Corporate

SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.

As a supplier of semiconductor equipment dedicated to high precision applications for over 40 years, SET has developed more than 34 different types of equipment. With more than 300 Device Bonders installed worldwide in more than 30 countries, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders.
First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

To discover SET’s environment, please watch its video corporate :

Our Missions

Strong focus on High End Device Bonding and Nano Imprinting Solutions
SET offers a complete range of accurate Flip-chip Bonders – manual, automated and production – that cover every high end bonding needs and requirements. The experience acquired for over 40 years of development benefits as well to our Nano Imprint Solutions.

SET's Values

History

Since 1975, SET develops and manufactures various advanced equipment for semiconductor industry. Since 1981, SET has pioneered in the development of flip chip bonders adapted to Infrared sensors & Optoelectronics applications, focusing now on Flip-Chip Bonders and Nano-Imprinting Solutions.

A Few Technical Milestones